Once the operation of galvanic growth has been completed, the parts are laid on a wafer and are brought to thickness via a grinding and lapping procedure.
 

Visual checking of all the parts allows us to detect any possible manufacturing fault (residual burrs, inhomogeneous surface finish, etc.)
 

The geometry of the parts is then checked using a profile projector and a gauge for the bores.
 

For parts needing the poli-mirror finish, with our tools we can perform bulk-polishing.  This finishing operation guarantees an incomparable surface quality (Ra 15nm) without modifying the geometry of the parts.