UV-LIGA manufacturing process
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A photo-mask is positioned above a wafer that has been previously treated with a layer of photo-sensitive resin. UV radiation passes through the photo-mask and polymerises the resin. |
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The non-polymerised resin is dissolved through the development process. A cavity remains on the substrate as a negative of the part to be made. |
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Once the process of mould structuring has been completed, the wafer is plunged into a galvanic bath where it undergoes material electro-plating within the cavities. |
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After galvanic growth, desired thickness is achieved via a lapping process. The substrate and resin are then dissolved so that the ready-to-use parts can be recovered. |
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